Surface Preparation of Aluminum for Plating by Zincating
The objective of this work is to gain better understanding of theinfluence of zincate bath chemistry on zincating morphology of Aluminumbond pads to provide reference for zincating chemistry design and processcontrol for wafer bumping applications.
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Unviversity of Technology- Iraq
2007-12-01
|
| Series: | Engineering and Technology Journal |
| Subjects: | |
| Online Access: | https://etj.uotechnology.edu.iq/article_25996_3513ac53835f668358ac9514ad51e973.pdf |