Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method
The buckling, de-lamination, and cracking of the thin film/substrate system caused by thermal stress is the main obstacle for functional failure. Moreover, the thermal stress of vanadium dioxide (VO<sub>2</sub>) thin film may be more complicated due to the stress re-distribution caused b...
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MDPI AG
2022-11-01
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| Series: | Nanomaterials |
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| Online Access: | https://www.mdpi.com/2079-4991/12/23/4262 |
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| author | Yuemin Wang Lebin Wang Jinxin Gu Xiangqiao Yan Jiarui Lu Shuliang Dou Yao Li Lei Wang |
| author_facet | Yuemin Wang Lebin Wang Jinxin Gu Xiangqiao Yan Jiarui Lu Shuliang Dou Yao Li Lei Wang |
| author_sort | Yuemin Wang |
| collection | DOAJ |
| description | The buckling, de-lamination, and cracking of the thin film/substrate system caused by thermal stress is the main obstacle for functional failure. Moreover, the thermal stress of vanadium dioxide (VO<sub>2</sub>) thin film may be more complicated due to the stress re-distribution caused by phase transition. Therefore, the thermal stress of VO<sub>2</sub> thin films deposited on four substrates with different materials (fused silica, silicon slice, sapphire, and glass) has been studied by finite element method in the present work. The influences of external temperature, substrate, and interlayer on thermal stress were analyzed. It was found that the substrates can greatly affect the thermal stresses, which were mainly caused by the mismatch of coefficient of thermal expansion (CTE). The thermal stress had a linear relationship with the external temperature, but this tendency would be redistributed or even change direction when phase transition occurred. The simulated results were in tandem with the analytical method. Meanwhile, the radial stress and shear stress distribution under the influence of phase transition were calculated. In addition, the reduction of thermal stress and shear stress showed that the appropriate interlayer can enhance the adhesive strength effectively. |
| first_indexed | 2024-03-09T17:38:09Z |
| format | Article |
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| institution | Directory Open Access Journal |
| issn | 2079-4991 |
| language | English |
| last_indexed | 2024-03-09T17:38:09Z |
| publishDate | 2022-11-01 |
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| series | Nanomaterials |
| spelling | doaj.art-e19db41511904fe09663b0a65fa184972023-11-24T11:48:07ZengMDPI AGNanomaterials2079-49912022-11-011223426210.3390/nano12234262Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element MethodYuemin Wang0Lebin Wang1Jinxin Gu2Xiangqiao Yan3Jiarui Lu4Shuliang Dou5Yao Li6Lei Wang7Shenzhen Key Laboratory of Polymer Science and Technology, College of Materials Science and Engineering, Shenzhen University, Shenzhen 518060, ChinaSchool of Materials, Sun Yat-Sen University, Shenzhen 518107, ChinaCenter for Composite Materials and Structure, Science and Technology on Advanced Composites in Special Environment Laboratory, Harbin Institute of Technology, Harbin 150080, ChinaCenter for Composite Materials and Structure, Science and Technology on Advanced Composites in Special Environment Laboratory, Harbin Institute of Technology, Harbin 150080, ChinaSchool of Engineering, Hong Kong University of Science and Technology, Hong Kong 999077, ChinaCenter for Composite Materials and Structure, Science and Technology on Advanced Composites in Special Environment Laboratory, Harbin Institute of Technology, Harbin 150080, ChinaCenter for Composite Materials and Structure, Science and Technology on Advanced Composites in Special Environment Laboratory, Harbin Institute of Technology, Harbin 150080, ChinaShenzhen Key Laboratory of Polymer Science and Technology, College of Materials Science and Engineering, Shenzhen University, Shenzhen 518060, ChinaThe buckling, de-lamination, and cracking of the thin film/substrate system caused by thermal stress is the main obstacle for functional failure. Moreover, the thermal stress of vanadium dioxide (VO<sub>2</sub>) thin film may be more complicated due to the stress re-distribution caused by phase transition. Therefore, the thermal stress of VO<sub>2</sub> thin films deposited on four substrates with different materials (fused silica, silicon slice, sapphire, and glass) has been studied by finite element method in the present work. The influences of external temperature, substrate, and interlayer on thermal stress were analyzed. It was found that the substrates can greatly affect the thermal stresses, which were mainly caused by the mismatch of coefficient of thermal expansion (CTE). The thermal stress had a linear relationship with the external temperature, but this tendency would be redistributed or even change direction when phase transition occurred. The simulated results were in tandem with the analytical method. Meanwhile, the radial stress and shear stress distribution under the influence of phase transition were calculated. In addition, the reduction of thermal stress and shear stress showed that the appropriate interlayer can enhance the adhesive strength effectively.https://www.mdpi.com/2079-4991/12/23/4262vanadium dioxide thin filmfinite element simulationthermal stressinterlayerphase transition |
| spellingShingle | Yuemin Wang Lebin Wang Jinxin Gu Xiangqiao Yan Jiarui Lu Shuliang Dou Yao Li Lei Wang Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method Nanomaterials vanadium dioxide thin film finite element simulation thermal stress interlayer phase transition |
| title | Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method |
| title_full | Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method |
| title_fullStr | Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method |
| title_full_unstemmed | Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method |
| title_short | Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method |
| title_sort | analysis of thermal stress in vanadium dioxide thin films by finite element method |
| topic | vanadium dioxide thin film finite element simulation thermal stress interlayer phase transition |
| url | https://www.mdpi.com/2079-4991/12/23/4262 |
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