Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method

Analysis of Thermal Stress in Vanadium Dioxide Thin Films by Finite Element Method

The buckling, de-lamination, and cracking of the thin film/substrate system caused by thermal stress is the main obstacle for functional failure. Moreover, the thermal stress of vanadium dioxide (VO<sub>2</sub>) thin film may be more complicated due to the stress re-distribution caused b...

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Bibliographic Details
Main Authors: Yuemin Wang, Lebin Wang, Jinxin Gu, Xiangqiao Yan, Jiarui Lu, Shuliang Dou, Yao Li, Lei Wang
Format: Article
Language:English
Published: MDPI AG 2022-11-01
Series:Nanomaterials
Subjects:
vanadium dioxide thin film
finite element simulation
thermal stress
interlayer
phase transition
Online Access:https://www.mdpi.com/2079-4991/12/23/4262

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