Slurry Design for Chemical Mechanical Polishing

Slurry Design for Chemical Mechanical Polishing

Chemical Mechanical Polishing (CMP) process is widely used in the microelectronics industry for planarization of metal and dielectric layers to achieve multi-layer metallization. For an effective polishing, it is necessary to minimize the surf...

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Bibliographic Details
Main Authors: G. Bahar Basim, Brij M. Moudgil
Format: Article
Language:English
Published: Hosokawa Powder Technology Foundation 2014-03-01
Series:KONA Powder and Particle Journal
Subjects:
chemical mechanical polishing (cmp)
chemically altered thin films
particle size
particle size distribution
slurry stability
interaction forces
Online Access:https://www.jstage.jst.go.jp/article/kona/21/0/21_2003020/_pdf/-char/en

Internet

https://www.jstage.jst.go.jp/article/kona/21/0/21_2003020/_pdf/-char/en

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