Slurry Design for Chemical Mechanical Polishing
Chemical Mechanical Polishing (CMP) process is widely used in the microelectronics industry for planarization of metal and dielectric layers to achieve multi-layer metallization. For an effective polishing, it is necessary to minimize the surf...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Hosokawa Powder Technology Foundation
2014-03-01
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| Series: | KONA Powder and Particle Journal |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/kona/21/0/21_2003020/_pdf/-char/en |