Vibration-Based In-Situ Detection and Quantification of Delamination in Composite Plates
This paper presents a new methodology for detecting and quantifying delamination in composite plates based on the high-frequency local vibration under the excitation of piezoelectric wafer active sensors. Finite-element-method-based numerical simulations and experimental measurements were performed...
Main Authors: | , , , , , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2019-04-01
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Series: | Sensors |
Subjects: | |
Online Access: | https://www.mdpi.com/1424-8220/19/7/1734 |