Modeling and analyzing coupling noise effect of Cu-carbon nanotube composite through-silicon vias interconnects using NILT based
In the modern field of microelectronics, the performance of interconnects tends to decrease as the technology node advances. Therefore, Cu-CNT composite TSV interconnects are utilized due to their favorable performance. In this article, Cu-CNT composite TSV interconnects have been studied....
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Faculty of Technical Sciences in Cacak
2023-01-01
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| Series: | Serbian Journal of Electrical Engineering |
| Subjects: | |
| Online Access: | https://doiserbia.nb.rs/img/doi/1451-4869/2023/1451-48692303301A.pdf |