Modeling and analyzing coupling noise effect of Cu-carbon nanotube composite through-silicon vias interconnects using NILT based
In the modern field of microelectronics, the performance of interconnects tends to decrease as the technology node advances. Therefore, Cu-CNT composite TSV interconnects are utilized due to their favorable performance. In this article, Cu-CNT composite TSV interconnects have been studied....
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Faculty of Technical Sciences in Cacak
2023-01-01
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| Series: | Serbian Journal of Electrical Engineering |
| Subjects: | |
| Online Access: | https://doiserbia.nb.rs/img/doi/1451-4869/2023/1451-48692303301A.pdf |
| _version_ | 1827586780868640768 |
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| author | Ait Belaid Khaoula Belahrach Hassan Ayad Hassan Ez-Zaki Fatima |
| author_facet | Ait Belaid Khaoula Belahrach Hassan Ayad Hassan Ez-Zaki Fatima |
| author_sort | Ait Belaid Khaoula |
| collection | DOAJ |
| description | In the modern field of microelectronics, the performance of interconnects
tends to decrease as the technology node advances. Therefore, Cu-CNT
composite TSV interconnects are utilized due to their favorable performance.
In this article, Cu-CNT composite TSV interconnects have been studied. The
objective of this work was to propose an accurate method for calculating
time domain coupling noise in 3D structures based on Cu-CNT composite TSVs.
The equivalent lumped element circuit, the NILT method, and the T-matrix
were exploited. Throughout the study, the influence of geometric parameters,
temperature, and CNT filling ratio were examined. The proposed method has
been validated using PSpice results. The obtained results have shown good
performance and accuracy. The average percentage error observed is less than
1 %. |
| first_indexed | 2024-03-09T00:07:38Z |
| format | Article |
| id | doaj.art-e3940f9479c8461d9db0587d1474ae03 |
| institution | Directory Open Access Journal |
| issn | 1451-4869 2217-7183 |
| language | English |
| last_indexed | 2024-03-09T00:07:38Z |
| publishDate | 2023-01-01 |
| publisher | Faculty of Technical Sciences in Cacak |
| record_format | Article |
| series | Serbian Journal of Electrical Engineering |
| spelling | doaj.art-e3940f9479c8461d9db0587d1474ae032023-12-12T13:08:53ZengFaculty of Technical Sciences in CacakSerbian Journal of Electrical Engineering1451-48692217-71832023-01-0120330131410.2298/SJEE2303301A1451-48692303301AModeling and analyzing coupling noise effect of Cu-carbon nanotube composite through-silicon vias interconnects using NILT basedAit Belaid Khaoula0Belahrach Hassan1Ayad Hassan2Ez-Zaki Fatima3Laboratory of Electrical Systems, Energy Efficiency, and Telecommunications, Cadi Ayyad University, Marrakesh, MoroccoElectrical Engineering Department, Royal School of Aeronautics, Marrakesh, MoroccoLaboratory of Electrical Systems, Energy Efficiency, and Telecommunications, Cadi Ayyad University, Marrakesh, MoroccoLaboratory of Electrical Systems, Energy Efficiency, and Telecommunications, Cadi Ayyad University, Marrakesh, MoroccoIn the modern field of microelectronics, the performance of interconnects tends to decrease as the technology node advances. Therefore, Cu-CNT composite TSV interconnects are utilized due to their favorable performance. In this article, Cu-CNT composite TSV interconnects have been studied. The objective of this work was to propose an accurate method for calculating time domain coupling noise in 3D structures based on Cu-CNT composite TSVs. The equivalent lumped element circuit, the NILT method, and the T-matrix were exploited. Throughout the study, the influence of geometric parameters, temperature, and CNT filling ratio were examined. The proposed method has been validated using PSpice results. The obtained results have shown good performance and accuracy. The average percentage error observed is less than 1 %.https://doiserbia.nb.rs/img/doi/1451-4869/2023/1451-48692303301A.pdf3d structurestsvcu-cnt compositenilt methodt-matrix |
| spellingShingle | Ait Belaid Khaoula Belahrach Hassan Ayad Hassan Ez-Zaki Fatima Modeling and analyzing coupling noise effect of Cu-carbon nanotube composite through-silicon vias interconnects using NILT based Serbian Journal of Electrical Engineering 3d structures tsv cu-cnt composite nilt method t-matrix |
| title | Modeling and analyzing coupling noise effect of Cu-carbon nanotube composite through-silicon vias interconnects using NILT based |
| title_full | Modeling and analyzing coupling noise effect of Cu-carbon nanotube composite through-silicon vias interconnects using NILT based |
| title_fullStr | Modeling and analyzing coupling noise effect of Cu-carbon nanotube composite through-silicon vias interconnects using NILT based |
| title_full_unstemmed | Modeling and analyzing coupling noise effect of Cu-carbon nanotube composite through-silicon vias interconnects using NILT based |
| title_short | Modeling and analyzing coupling noise effect of Cu-carbon nanotube composite through-silicon vias interconnects using NILT based |
| title_sort | modeling and analyzing coupling noise effect of cu carbon nanotube composite through silicon vias interconnects using nilt based |
| topic | 3d structures tsv cu-cnt composite nilt method t-matrix |
| url | https://doiserbia.nb.rs/img/doi/1451-4869/2023/1451-48692303301A.pdf |
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