Impact of TSV bump and redistribution layer on crosstalk delay and power loss
The performance of a 3D IC is primarily reliant on the selection of an appropriate bump shape. The most prevalent bump shape (cylindrical) is experiencing substantial stress, power loss and crosstalk issues. TSV bump with a tapered structure have recently attracted considerable attention owing to it...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-07-01
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| Series: | Memories - Materials, Devices, Circuits and Systems |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2773064623000178 |