Reliability of MEMS inertial devices in mechanical and thermal environments: A review
The reliability of MEMS inertial devices applied in complex environments involves interdisciplinary fields, such as structural mechanics, material mechanics and multi-physics field coupling. Nowadays, MEMS inertial devices are widely used in the fields of automotive industry, consumer electronics, a...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-03-01
|
| Series: | Heliyon |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2405844024035126 |
| _version_ | 1827316429465059328 |
|---|---|
| author | Yingyu Xu Shuibin Liu Chunhua He Heng Wu Lianglun Cheng Guizhen Yan Qinwen Huang |
| author_facet | Yingyu Xu Shuibin Liu Chunhua He Heng Wu Lianglun Cheng Guizhen Yan Qinwen Huang |
| author_sort | Yingyu Xu |
| collection | DOAJ |
| description | The reliability of MEMS inertial devices applied in complex environments involves interdisciplinary fields, such as structural mechanics, material mechanics and multi-physics field coupling. Nowadays, MEMS inertial devices are widely used in the fields of automotive industry, consumer electronics, aerospace and missile guidance, and a variety of reliability issues induced by complex environments arise subsequently. Hence, reliability analysis and design of MEMS inertial devices are becoming increasingly significant. Since the reliability issues of MEMS inertial devices are mainly caused by complex mechanical and thermal environments with intricate failure mechanisms, there are fewer reviews of related research in this field. Therefore, this paper provides an extensive review of the research on the reliability of typical failure modes and mechanisms in MEMS inertial devices under high temperature, temperature cycling, vibration, shock, and multi-physical field coupling environments in the last five to six years. It is found that though multiple studies exist examining the reliability of MEMS inertial devices under single stress, there is a dearth of research conducted under composite stress and a lack of systematic investigation. Through analyzing and summarizing the current research progress in reliability design, it is concluded that multi-physical field coupling simulation, theoretical modeling, composite stress experiments, and special test standards are important directions for future reliability research on MEMS inertial devices. |
| first_indexed | 2024-04-24T23:14:19Z |
| format | Article |
| id | doaj.art-e3f13fd8926b49cfa53bfc7a3ed70173 |
| institution | Directory Open Access Journal |
| issn | 2405-8440 |
| language | English |
| last_indexed | 2024-04-24T23:14:19Z |
| publishDate | 2024-03-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Heliyon |
| spelling | doaj.art-e3f13fd8926b49cfa53bfc7a3ed701732024-03-17T07:58:11ZengElsevierHeliyon2405-84402024-03-01105e27481Reliability of MEMS inertial devices in mechanical and thermal environments: A reviewYingyu Xu0Shuibin Liu1Chunhua He2Heng Wu3Lianglun Cheng4Guizhen Yan5Qinwen Huang6School of Computer, Guangdong University of Technology, Guangzhou, 510006, China; Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, 510000, ChinaSchool of Computer, Guangdong University of Technology, Guangzhou, 510006, ChinaSchool of Computer, Guangdong University of Technology, Guangzhou, 510006, China; Corresponding author.School of Computer, Guangdong University of Technology, Guangzhou, 510006, ChinaSchool of Computer, Guangdong University of Technology, Guangzhou, 510006, ChinaNational Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, 100871, ChinaScience and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute, Guangzhou, 510000, China; Corresponding author.The reliability of MEMS inertial devices applied in complex environments involves interdisciplinary fields, such as structural mechanics, material mechanics and multi-physics field coupling. Nowadays, MEMS inertial devices are widely used in the fields of automotive industry, consumer electronics, aerospace and missile guidance, and a variety of reliability issues induced by complex environments arise subsequently. Hence, reliability analysis and design of MEMS inertial devices are becoming increasingly significant. Since the reliability issues of MEMS inertial devices are mainly caused by complex mechanical and thermal environments with intricate failure mechanisms, there are fewer reviews of related research in this field. Therefore, this paper provides an extensive review of the research on the reliability of typical failure modes and mechanisms in MEMS inertial devices under high temperature, temperature cycling, vibration, shock, and multi-physical field coupling environments in the last five to six years. It is found that though multiple studies exist examining the reliability of MEMS inertial devices under single stress, there is a dearth of research conducted under composite stress and a lack of systematic investigation. Through analyzing and summarizing the current research progress in reliability design, it is concluded that multi-physical field coupling simulation, theoretical modeling, composite stress experiments, and special test standards are important directions for future reliability research on MEMS inertial devices.http://www.sciencedirect.com/science/article/pii/S2405844024035126MEMS inertial devicesThermal reliabilityMechanical reliabilityMultiphysics couplingFailure modes and mechanisms |
| spellingShingle | Yingyu Xu Shuibin Liu Chunhua He Heng Wu Lianglun Cheng Guizhen Yan Qinwen Huang Reliability of MEMS inertial devices in mechanical and thermal environments: A review Heliyon MEMS inertial devices Thermal reliability Mechanical reliability Multiphysics coupling Failure modes and mechanisms |
| title | Reliability of MEMS inertial devices in mechanical and thermal environments: A review |
| title_full | Reliability of MEMS inertial devices in mechanical and thermal environments: A review |
| title_fullStr | Reliability of MEMS inertial devices in mechanical and thermal environments: A review |
| title_full_unstemmed | Reliability of MEMS inertial devices in mechanical and thermal environments: A review |
| title_short | Reliability of MEMS inertial devices in mechanical and thermal environments: A review |
| title_sort | reliability of mems inertial devices in mechanical and thermal environments a review |
| topic | MEMS inertial devices Thermal reliability Mechanical reliability Multiphysics coupling Failure modes and mechanisms |
| url | http://www.sciencedirect.com/science/article/pii/S2405844024035126 |
| work_keys_str_mv | AT yingyuxu reliabilityofmemsinertialdevicesinmechanicalandthermalenvironmentsareview AT shuibinliu reliabilityofmemsinertialdevicesinmechanicalandthermalenvironmentsareview AT chunhuahe reliabilityofmemsinertialdevicesinmechanicalandthermalenvironmentsareview AT hengwu reliabilityofmemsinertialdevicesinmechanicalandthermalenvironmentsareview AT liangluncheng reliabilityofmemsinertialdevicesinmechanicalandthermalenvironmentsareview AT guizhenyan reliabilityofmemsinertialdevicesinmechanicalandthermalenvironmentsareview AT qinwenhuang reliabilityofmemsinertialdevicesinmechanicalandthermalenvironmentsareview |