Indirect Thermographic Temperature Measurement of a Power-Rectifying Diode Die Based on a Heat Sink Thermogram

This article concerns the indirect thermographic measurement of the junction temperature of a D00-250-10 semiconductor diode. Herein, we show how the temperature of the semiconductor junction was estimated on the basis of the heat sink temperature. We discuss the methodology of selecting the points...

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Bibliographic Details
Main Authors: Krzysztof Dziarski, Arkadiusz Hulewicz, Łukasz Drużyński, Grzegorz Dombek
Format: Article
Language:English
Published: MDPI AG 2022-12-01
Series:Energies
Subjects:
Online Access:https://www.mdpi.com/1996-1073/16/1/332