Modeling Insights Into the Assembly Challenges of Focal Plane Arrays
Ongoing technological advances in photodetector material growth and processing, readout integrated circuits, and robust hybridization (packaging) methods for assembling high-resolution and small-pitch size pixel arrays are the main enabling factors for pushing the frontiers of high-performance Focal...
Main Authors: | , |
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Format: | Article |
Language: | English |
Published: |
IEEE
2023-01-01
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Series: | IEEE Access |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/10092915/ |