Modeling Insights Into the Assembly Challenges of Focal Plane Arrays
Ongoing technological advances in photodetector material growth and processing, readout integrated circuits, and robust hybridization (packaging) methods for assembling high-resolution and small-pitch size pixel arrays are the main enabling factors for pushing the frontiers of high-performance Focal...
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| Format: | Article |
| Language: | English |
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IEEE
2023-01-01
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| Series: | IEEE Access |
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| Online Access: | https://ieeexplore.ieee.org/document/10092915/ |
| _version_ | 1797847393382694912 |
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| author | Stoyan Stoyanov Chris Bailey |
| author_facet | Stoyan Stoyanov Chris Bailey |
| author_sort | Stoyan Stoyanov |
| collection | DOAJ |
| description | Ongoing technological advances in photodetector material growth and processing, readout integrated circuits, and robust hybridization (packaging) methods for assembling high-resolution and small-pitch size pixel arrays are the main enabling factors for pushing the frontiers of high-performance Focal Plane Array (FPA) technologies for imaging systems. This paper details the development of analytical and numerical models and demonstrates their use to generate insights into the feasibility of two flip-chip assembly processes for packaging infrared (IR) detector chips. The modeling studies focus on the challenges of forming the indium interconnection arrays in the case of the FPA technologies using Group III-V compound semiconductor materials and ultra-fine pitch pixel array layouts. The accurate alignment of the IR detector chip onto the readout chip in the case of high-density pixel architectures is a critical requirement for the packaging process. To gain a better understanding of this requirement, which has a clear implication for the quality and subsequent reliability performance of the FPA, compression, and reflow bonding process models are developed using suitable modeling approaches and methods and then demonstrated for two distinctive focal plane array design configurations. The novelty of this work is in the developed modeling capabilities utilizing different computational methods, from large deformation and contact analysis finite element to energy-based and harmonic motion mechanics, to characterize and optimize the mechanical and dynamic non-linear behavior of the indium solder joints and their formation during FPA packaging. The feasibility of bonding techniques for different resolution FPAs and under flip-chip misalignment conditions is assessed. The modeling results pointed to a very strict, sub-micrometer flip-chip placement accuracy requirement for the assembly of FPAs with ultra-fine indium bump array resolution. |
| first_indexed | 2024-04-09T18:10:40Z |
| format | Article |
| id | doaj.art-e42a4b667b2440ec8f9855e2a6a29c64 |
| institution | Directory Open Access Journal |
| issn | 2169-3536 |
| language | English |
| last_indexed | 2024-04-09T18:10:40Z |
| publishDate | 2023-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Access |
| spelling | doaj.art-e42a4b667b2440ec8f9855e2a6a29c642023-04-13T23:01:05ZengIEEEIEEE Access2169-35362023-01-0111352073521910.1109/ACCESS.2023.326480610092915Modeling Insights Into the Assembly Challenges of Focal Plane ArraysStoyan Stoyanov0https://orcid.org/0000-0001-6091-1226Chris Bailey1https://orcid.org/0000-0002-9438-3879School of Computing and Mathematical Sciences, University of Greenwich, London, U.KSchool of Electrical, Computer and Energy Engineering, Arizona State University, Tempe, AZ, USAOngoing technological advances in photodetector material growth and processing, readout integrated circuits, and robust hybridization (packaging) methods for assembling high-resolution and small-pitch size pixel arrays are the main enabling factors for pushing the frontiers of high-performance Focal Plane Array (FPA) technologies for imaging systems. This paper details the development of analytical and numerical models and demonstrates their use to generate insights into the feasibility of two flip-chip assembly processes for packaging infrared (IR) detector chips. The modeling studies focus on the challenges of forming the indium interconnection arrays in the case of the FPA technologies using Group III-V compound semiconductor materials and ultra-fine pitch pixel array layouts. The accurate alignment of the IR detector chip onto the readout chip in the case of high-density pixel architectures is a critical requirement for the packaging process. To gain a better understanding of this requirement, which has a clear implication for the quality and subsequent reliability performance of the FPA, compression, and reflow bonding process models are developed using suitable modeling approaches and methods and then demonstrated for two distinctive focal plane array design configurations. The novelty of this work is in the developed modeling capabilities utilizing different computational methods, from large deformation and contact analysis finite element to energy-based and harmonic motion mechanics, to characterize and optimize the mechanical and dynamic non-linear behavior of the indium solder joints and their formation during FPA packaging. The feasibility of bonding techniques for different resolution FPAs and under flip-chip misalignment conditions is assessed. The modeling results pointed to a very strict, sub-micrometer flip-chip placement accuracy requirement for the assembly of FPAs with ultra-fine indium bump array resolution.https://ieeexplore.ieee.org/document/10092915/IR detectorsfocal plane arraycompression bonding simulationreflow self-alignment modelingindium jointsultra-fine pitch flip chip assembly |
| spellingShingle | Stoyan Stoyanov Chris Bailey Modeling Insights Into the Assembly Challenges of Focal Plane Arrays IEEE Access IR detectors focal plane array compression bonding simulation reflow self-alignment modeling indium joints ultra-fine pitch flip chip assembly |
| title | Modeling Insights Into the Assembly Challenges of Focal Plane Arrays |
| title_full | Modeling Insights Into the Assembly Challenges of Focal Plane Arrays |
| title_fullStr | Modeling Insights Into the Assembly Challenges of Focal Plane Arrays |
| title_full_unstemmed | Modeling Insights Into the Assembly Challenges of Focal Plane Arrays |
| title_short | Modeling Insights Into the Assembly Challenges of Focal Plane Arrays |
| title_sort | modeling insights into the assembly challenges of focal plane arrays |
| topic | IR detectors focal plane array compression bonding simulation reflow self-alignment modeling indium joints ultra-fine pitch flip chip assembly |
| url | https://ieeexplore.ieee.org/document/10092915/ |
| work_keys_str_mv | AT stoyanstoyanov modelinginsightsintotheassemblychallengesoffocalplanearrays AT chrisbailey modelinginsightsintotheassemblychallengesoffocalplanearrays |