Dynamic Tensile Extrusion Behavior of Fine-Grained Copper Fabricated by Powder Injection Molding

The dynamic tensile extrusion (DTE) behavior and microstructural evolution of fine-grained (FG, ~1 μm < d < ~10 μm) Cu fabricated by powder injection molding (PIM) were investigated. The FGM Cu was fabricated by PIM with commercial micro-sized Cu powder sintering at 850 °C for 2 h, while the F...

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Bibliographic Details
Main Authors: Keunho Lee, Sanghyun Woo, Leeju Park
Format: Article
Language:English
Published: MDPI AG 2022-01-01
Series:Crystals
Subjects:
Online Access:https://www.mdpi.com/2073-4352/12/2/147