High-Throughput Multiple Dies-to-Wafer Bonding Technology and III/V-on-Si Hybrid Lasers for Heterogeneous Integration of Optoelectronic Integrated Circuits

High-Throughput Multiple Dies-to-Wafer Bonding Technology and III/V-on-Si Hybrid Lasers for Heterogeneous Integration of Optoelectronic Integrated Circuits

Integrated optical light source on silicon is one of the key building blocks for optical interconnect technology. Great research efforts have been devoting worldwide to explore various approaches to integrate optical light source onto the silicon substrate. The achievements so far include the succes...

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Bibliographic Details
Main Authors: Xianshu eLuo, Yulian eCao, Junfeng eSong, Xiaonan eHu, Yungbing eCheng, Chengming eLi, Chongyang eLiu, Tsung-Yang eLiow, Mingbin eYu, Hong eWang, Qijie eWang, Patrick Guo-Qiang eLo
Format: Article
Language:English
Published: Frontiers Media S.A. 2015-04-01
Series:Frontiers in Materials
Subjects:
Heterogeneous integration
silicon photonics
Hybrid lasers
Optoelectronic integrated circuits
Die-to-Wafer Bonding
Online Access:http://journal.frontiersin.org/Journal/10.3389/fmats.2015.00028/full

Internet

http://journal.frontiersin.org/Journal/10.3389/fmats.2015.00028/full

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