Al-Cu intermetallic phase growth in hybrid metal extrusion & bonding welds exposed to isothermal annealing or direct current cycling
Joining of aluminium (Al) to copper (Cu) is of great interest to power generation, transportation and electronic industry. However, dissimilar metal joining often promotes intermetallic phase formation at the joined interface, which in redundancy can cause mechanical degradation and increased electr...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-04-01
|
| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127524002405 |