Tightly Compacted Perovskite Laminates on Flexible Substrates via Hot-Pressing
Pressure and temperature are powerful tools applied to perovskites to achieve recrystallization. Lamination, based on recrystallization of perovskites, avoids the limitations and improves the compatibility of materials and solvents in perovskite device architectures. In this work, we demonstrate tig...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-03-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/10/6/1917 |