Liquid cooling of microelectronic chips using MEMS heat sink: Thermohydraulic characteristics of wavy microchannels with pin-fins
This article details the mathematical modeling and experimental validation of a liquid based MEMS heat sink using wavy microchannels with pin-fins for cooling of microelectronic chips with heat flux of 1000 kW/m2. The characteristics of the heat sink are evaluated using thermal resistance, pumping p...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-05-01
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| Series: | International Journal of Thermofluids |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666202723000332 |