Effect of AlN on the microstructure evolution of Cu/Sn58Bi/Cu solder joints for 3D packaging at different bonding times
Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.05AlN/Cu were prepared by transient liquid-phase bonding (TLP) bonding process for low temperature bonding and high temperature service. The evolution of interfacial IMC and the influence mechanism of AlN on TLP solder joints were studied. During the bonding process, the...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-07-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423014941 |