Effect of AlN on the microstructure evolution of Cu/Sn58Bi/Cu solder joints for 3D packaging at different bonding times
Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.05AlN/Cu were prepared by transient liquid-phase bonding (TLP) bonding process for low temperature bonding and high temperature service. The evolution of interfacial IMC and the influence mechanism of AlN on TLP solder joints were studied. During the bonding process, the...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2023-07-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423014941 |
| _version_ | 1797745225444098048 |
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| author | Xi Wang Liang Zhang Chen Chen Xiao Lu |
| author_facet | Xi Wang Liang Zhang Chen Chen Xiao Lu |
| author_sort | Xi Wang |
| collection | DOAJ |
| description | Cu/Sn58Bi/Cu and Cu/Sn58Bi-0.05AlN/Cu were prepared by transient liquid-phase bonding (TLP) bonding process for low temperature bonding and high temperature service. The evolution of interfacial IMC and the influence mechanism of AlN on TLP solder joints were studied. During the bonding process, the top and bottom IMC show asymmetric growth. With the increase of bonding time, Cu6Sn5 and Cu3Sn in the two solder joints continue to grow, and finally complete IMC morphology can be formed, of which Cu6Sn5 IMC is more and Cu3Sn IMC is less. In addition, by calculating the growth rate of Cu3Sn IMC, it was found that the growth rate of Cu3Sn IMC at both ends of the three-dimensional solder joint containing AlN is suppressed. |
| first_indexed | 2024-03-12T15:20:20Z |
| format | Article |
| id | doaj.art-e69eb9f56661403bb1e7363770e0d264 |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-03-12T15:20:20Z |
| publishDate | 2023-07-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-e69eb9f56661403bb1e7363770e0d2642023-08-11T05:34:03ZengElsevierJournal of Materials Research and Technology2238-78542023-07-012544884496Effect of AlN on the microstructure evolution of Cu/Sn58Bi/Cu solder joints for 3D packaging at different bonding timesXi Wang0Liang Zhang1Chen Chen2Xiao Lu3School of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361024, China; School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou 221116, ChinaSchool of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361024, China; Corresponding author.School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou 221116, ChinaSchool of Mechatronic Engineering, Jiangsu Normal University, Xuzhou 221116, ChinaCu/Sn58Bi/Cu and Cu/Sn58Bi-0.05AlN/Cu were prepared by transient liquid-phase bonding (TLP) bonding process for low temperature bonding and high temperature service. The evolution of interfacial IMC and the influence mechanism of AlN on TLP solder joints were studied. During the bonding process, the top and bottom IMC show asymmetric growth. With the increase of bonding time, Cu6Sn5 and Cu3Sn in the two solder joints continue to grow, and finally complete IMC morphology can be formed, of which Cu6Sn5 IMC is more and Cu3Sn IMC is less. In addition, by calculating the growth rate of Cu3Sn IMC, it was found that the growth rate of Cu3Sn IMC at both ends of the three-dimensional solder joint containing AlN is suppressed.http://www.sciencedirect.com/science/article/pii/S2238785423014941TLPSn58BiSolder jointAlN nanoparticles |
| spellingShingle | Xi Wang Liang Zhang Chen Chen Xiao Lu Effect of AlN on the microstructure evolution of Cu/Sn58Bi/Cu solder joints for 3D packaging at different bonding times Journal of Materials Research and Technology TLP Sn58Bi Solder joint AlN nanoparticles |
| title | Effect of AlN on the microstructure evolution of Cu/Sn58Bi/Cu solder joints for 3D packaging at different bonding times |
| title_full | Effect of AlN on the microstructure evolution of Cu/Sn58Bi/Cu solder joints for 3D packaging at different bonding times |
| title_fullStr | Effect of AlN on the microstructure evolution of Cu/Sn58Bi/Cu solder joints for 3D packaging at different bonding times |
| title_full_unstemmed | Effect of AlN on the microstructure evolution of Cu/Sn58Bi/Cu solder joints for 3D packaging at different bonding times |
| title_short | Effect of AlN on the microstructure evolution of Cu/Sn58Bi/Cu solder joints for 3D packaging at different bonding times |
| title_sort | effect of aln on the microstructure evolution of cu sn58bi cu solder joints for 3d packaging at different bonding times |
| topic | TLP Sn58Bi Solder joint AlN nanoparticles |
| url | http://www.sciencedirect.com/science/article/pii/S2238785423014941 |
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