Direct bonding of aluminum to alumina using a nickel interlayer for power electronics applications
Three films of Ni with thicknesses of 100, 300, and 500 nm were deposited on an Al2O3 base and direct bonded with Al to form high-power electronic substrates for comparison. The microstructures of Al/Al2O3 joints were evaluated using a scanning electron microscope (SEM) and transmission electron mi...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2020-06-01
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| Series: | Results in Materials |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590048X20300352 |