Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging
Copper is the most common interconnecting material in the field of microelectronic packaging, which is widely used in advanced electronic packaging technologies. However, with the trend of the miniaturization of electronic devices, the dimensions of interconnectors have decreased from hundreds of mi...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-06-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/16/13/4614 |