Preparation and Properties of High-Volume-Fraction SiC Reinforced Copper Matrix Composites

With the rapid development of modern industry, SiC/Cu composites have great application prospect in electronic packaging due to their excellent conductivity, high strength and thermal conductivity. In this paper, high-volume-fraction β-Sic@Cu/Cu composites were successfully prepared by electroless p...

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Detalhes bibliográficos
Autor principal: ZHANG Qiang, YANG Chenggang, YAO Bo, WU Jisi, QIAN Wen
Formato: Artigo
Idioma:zho
Publicado em: Editorial Department of Materials Protection 2022-12-01
coleção:Cailiao Baohu
Assuntos:
Acesso em linha:http://www.mat-pro.com/fileup/1001-1560/PDF/20221220.pdf

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