Preparation and Properties of High-Volume-Fraction SiC Reinforced Copper Matrix Composites
With the rapid development of modern industry, SiC/Cu composites have great application prospect in electronic packaging due to their excellent conductivity, high strength and thermal conductivity. In this paper, high-volume-fraction β-Sic@Cu/Cu composites were successfully prepared by electroless p...
Autor principal: | ZHANG Qiang, YANG Chenggang, YAO Bo, WU Jisi, QIAN Wen |
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Formato: | Artigo |
Idioma: | zho |
Publicado em: |
Editorial Department of Materials Protection
2022-12-01
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coleção: | Cailiao Baohu |
Assuntos: | |
Acesso em linha: | http://www.mat-pro.com/fileup/1001-1560/PDF/20221220.pdf |
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