Comparison between bulk and particle solder alloy on the performance of low-melting solder joints

The influence of uniformity and small size solder particles on microstructure evolution and mechanical performances of low temperature soldering joints was investigated. First, experiments were set up to obtain uniform and small-size solder particles, which were compared to bulk solder joints by usi...

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Bibliographic Details
Main Authors: Mingkun Yang, Xiuchen Zhao, Yongjun Huo, King-Ning Tu, Yingxia Liu
Format: Article
Language:English
Published: Elsevier 2023-05-01
Series:Journal of Materials Research and Technology
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785423004593