Surface Modification and Direct Bonding of Different Materials Irradiated H2O Ion

Reliable joining technologies are essential for fabrication of microstructures such as micro-machines, and particularly technologies that are capable of jointing different types of materials. However, these technologies cannot be used for materials that have different rates of thermal expansion or i...

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Main Authors: Kazufumi NISHIMOTO, Naoya ISHIZAWA, Hiroyasu UEDA, Daiji NODA, Tadashi HATTORI
Format: Article
Language:English
Published: The Japan Society of Mechanical Engineers 2008-04-01
Series:Journal of Advanced Mechanical Design, Systems, and Manufacturing
Subjects:
Online Access:https://www.jstage.jst.go.jp/article/jamdsm/2/2/2_2_197/_pdf/-char/en
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author Kazufumi NISHIMOTO
Naoya ISHIZAWA
Hiroyasu UEDA
Daiji NODA
Tadashi HATTORI
author_facet Kazufumi NISHIMOTO
Naoya ISHIZAWA
Hiroyasu UEDA
Daiji NODA
Tadashi HATTORI
author_sort Kazufumi NISHIMOTO
collection DOAJ
description Reliable joining technologies are essential for fabrication of microstructures such as micro-machines, and particularly technologies that are capable of jointing different types of materials. However, these technologies cannot be used for materials that have different rates of thermal expansion or in cases where the adhesives have an effect on the properties of the component materials. Our research focused on developing a direct jointing technology which employs hydrogen bonding. In this technology, OH radicals are absorbed into the surface of the material to be bonded by modifying its surface properties by ion irradiation. We studied the modification of the surface properties of two resins, (SU-8 and PMMA) by H2O ion irradiation and Ar cleaning. It was confirmed that the presence of H2O ions on the surface of these resins improved their hydrophilic properties and also the peel strengths of Cu membrane s deposited onto both resins. Based on the results of these studies, a series of experiments were conducted in which two different materials, (copper plus one or other of the resins) were joined directly and the results were evaluated. Each of the resins could be joined to copper by heating to a temperature of 100°C and pressurizing to 10 MPa. This jointing technology will now be applied to the fabrication of the tilt sensors that we are currently developing.
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spelling doaj.art-e89960ee5c5446e79f85fdaf8ae9fd372022-12-22T03:38:57ZengThe Japan Society of Mechanical EngineersJournal of Advanced Mechanical Design, Systems, and Manufacturing1881-30542008-04-012219720210.1299/jamdsm.2.197jamdsmSurface Modification and Direct Bonding of Different Materials Irradiated H2O IonKazufumi NISHIMOTO0Naoya ISHIZAWA1Hiroyasu UEDA2Daiji NODA3Tadashi HATTORI4Laboratory of Advanced Science & Technology for Industry, University of HyogoLaboratory of Advanced Science & Technology for Industry, University of HyogoTOKAI RIKA CO., LTD.Laboratory of Advanced Science & Technology for Industry, University of HyogoLaboratory of Advanced Science & Technology for Industry, University of HyogoReliable joining technologies are essential for fabrication of microstructures such as micro-machines, and particularly technologies that are capable of jointing different types of materials. However, these technologies cannot be used for materials that have different rates of thermal expansion or in cases where the adhesives have an effect on the properties of the component materials. Our research focused on developing a direct jointing technology which employs hydrogen bonding. In this technology, OH radicals are absorbed into the surface of the material to be bonded by modifying its surface properties by ion irradiation. We studied the modification of the surface properties of two resins, (SU-8 and PMMA) by H2O ion irradiation and Ar cleaning. It was confirmed that the presence of H2O ions on the surface of these resins improved their hydrophilic properties and also the peel strengths of Cu membrane s deposited onto both resins. Based on the results of these studies, a series of experiments were conducted in which two different materials, (copper plus one or other of the resins) were joined directly and the results were evaluated. Each of the resins could be joined to copper by heating to a temperature of 100°C and pressurizing to 10 MPa. This jointing technology will now be applied to the fabrication of the tilt sensors that we are currently developing.https://www.jstage.jst.go.jp/article/jamdsm/2/2/2_2_197/_pdf/-char/enhydrogen bondingh2o ion irradiationar cleaningsurface modificationdirect jointing of different materials
spellingShingle Kazufumi NISHIMOTO
Naoya ISHIZAWA
Hiroyasu UEDA
Daiji NODA
Tadashi HATTORI
Surface Modification and Direct Bonding of Different Materials Irradiated H2O Ion
Journal of Advanced Mechanical Design, Systems, and Manufacturing
hydrogen bonding
h2o ion irradiation
ar cleaning
surface modification
direct jointing of different materials
title Surface Modification and Direct Bonding of Different Materials Irradiated H2O Ion
title_full Surface Modification and Direct Bonding of Different Materials Irradiated H2O Ion
title_fullStr Surface Modification and Direct Bonding of Different Materials Irradiated H2O Ion
title_full_unstemmed Surface Modification and Direct Bonding of Different Materials Irradiated H2O Ion
title_short Surface Modification and Direct Bonding of Different Materials Irradiated H2O Ion
title_sort surface modification and direct bonding of different materials irradiated h2o ion
topic hydrogen bonding
h2o ion irradiation
ar cleaning
surface modification
direct jointing of different materials
url https://www.jstage.jst.go.jp/article/jamdsm/2/2/2_2_197/_pdf/-char/en
work_keys_str_mv AT kazufuminishimoto surfacemodificationanddirectbondingofdifferentmaterialsirradiatedh2oion
AT naoyaishizawa surfacemodificationanddirectbondingofdifferentmaterialsirradiatedh2oion
AT hiroyasuueda surfacemodificationanddirectbondingofdifferentmaterialsirradiatedh2oion
AT daijinoda surfacemodificationanddirectbondingofdifferentmaterialsirradiatedh2oion
AT tadashihattori surfacemodificationanddirectbondingofdifferentmaterialsirradiatedh2oion