Editorial for the Special Issue on Advanced Interconnect and Packaging
Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation [...]
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-01-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/14/1/171 |