Novel Processing Algorithm to Improve Detectability of Disbonds in Adhesive Dissimilar Material Joints
Adhesively bonded dissimilar materials have attracted high interest in the aerospace and automotive industries due to their ability to provide superior structural characteristics and reduce the weight for energy savings. This work focuses on the improvement of disbond-type defect detectability using...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-04-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1424-8220/21/9/3048 |