Scalable Microfabrication Procedures for Adhesive-Integrated Flexible and Stretchable Electronic Sensors

Scalable Microfabrication Procedures for Adhesive-Integrated Flexible and Stretchable Electronic Sensors

New classes of ultrathin flexible and stretchable devices have changed the way modern electronics are designed to interact with their target systems. Though more and more novel technologies surface and steer the way we think about future electronics, there exists an unmet need in regards to optimizi...

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Bibliographic Details
Main Authors: Dae Y. Kang, Yun-Soung Kim, Gladys Ornelas, Mridu Sinha, Keerthiga Naidu, Todd P. Coleman
Format: Article
Language:English
Published: MDPI AG 2015-09-01
Series:Sensors
Subjects:
flexible electronics
roll-to-roll
peel-off
flexible sensors
Online Access:http://www.mdpi.com/1424-8220/15/9/23459

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http://www.mdpi.com/1424-8220/15/9/23459

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