Scalable Microfabrication Procedures for Adhesive-Integrated Flexible and Stretchable Electronic Sensors
New classes of ultrathin flexible and stretchable devices have changed the way modern electronics are designed to interact with their target systems. Though more and more novel technologies surface and steer the way we think about future electronics, there exists an unmet need in regards to optimizi...
Main Authors: | Dae Y. Kang, Yun-Soung Kim, Gladys Ornelas, Mridu Sinha, Keerthiga Naidu, Todd P. Coleman |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2015-09-01
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Series: | Sensors |
Subjects: | |
Online Access: | http://www.mdpi.com/1424-8220/15/9/23459 |
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