A Wafer Level Vacuum Encapsulated Capacitive Accelerometer Fabricated in an Unmodified Commercial MEMS Process

A Wafer Level Vacuum Encapsulated Capacitive Accelerometer Fabricated in an Unmodified Commercial MEMS Process

We present the design and fabrication of a single axis low noise accelerometer in an unmodified commercial MicroElectroMechanical Systems (MEMS) process. The new microfabrication process, MEMS Integrated Design for Inertial Sensors (MIDIS), introduced by Teledyne DALSA Inc. allows wafer level vacuum...

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Bibliographic Details
Main Authors: Adel Merdassi, Peng Yang, Vamsy P. Chodavarapu
Format: Article
Language:English
Published: MDPI AG 2015-03-01
Series:Sensors
Subjects:
MEMS accelerometer
capacitive sensor
commercial MEMS process
low noise sensor
wafer-level vacuum encapsulation
Teledyne DALSA MIDIS process
inertial sensor
Online Access:http://www.mdpi.com/1424-8220/15/4/7349

Internet

http://www.mdpi.com/1424-8220/15/4/7349

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