3D reconstruction and defect pattern recognition of bonding wire based on stereo vision
Abstract Non‐destructive detection of wire bonding defects in integrated circuits (IC) is critical for ensuring product quality after packaging. Image‐processing‐based methods do not provide a detailed evaluation of the three‐dimensional defects of the bonding wire. Therefore, a method of 3D reconst...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2024-04-01
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| Series: | CAAI Transactions on Intelligence Technology |
| Subjects: | |
| Online Access: | https://doi.org/10.1049/cit2.12240 |