Multimodal machine learning for predicting heat transfer characteristics in micro-pin fin heat sinks

Multimodal machine learning for predicting heat transfer characteristics in micro-pin fin heat sinks

As three-dimensional integrated circuit (3D-IC) chip technology advances, thermal management has become increasingly important because of increasing heat flux from thermal stacking. Micro-pin fin-embedded cooling has emerged as a promising solution for 3D-ICs, offering better thermal and hydraulic p...

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Bibliographic Details
Main Authors: Haeun Lee, Geonhee Lee, Kiwan Kim, Daeyoung Kong, Hyoungsoon Lee
Format: Article
Language:English
Published: Elsevier 2024-05-01
Series:Case Studies in Thermal Engineering
Subjects:
Multimodal
Deep learning
Thermal management
Boiling
Two-phase flow
Micro-pin fin heat sink
Online Access:http://www.sciencedirect.com/science/article/pii/S2214157X24003629

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http://www.sciencedirect.com/science/article/pii/S2214157X24003629

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