Multimodal machine learning for predicting heat transfer characteristics in micro-pin fin heat sinks
As three-dimensional integrated circuit (3D-IC) chip technology advances, thermal management has become increasingly important because of increasing heat flux from thermal stacking. Micro-pin fin-embedded cooling has emerged as a promising solution for 3D-ICs, offering better thermal and hydraulic p...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2024-05-01
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| Series: | Case Studies in Thermal Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X24003629 |