Accelerated solid-liquid interdiffusion bonding of Cu joint using a Cu10Ni alloy mesh reinforced SAC305 composite solder

Accelerated solid-liquid interdiffusion bonding of Cu joint using a Cu10Ni alloy mesh reinforced SAC305 composite solder

High reliable packaging materials are essential for wide band-gap power devices due to the thermal and mechanical stresses arising from extreme environmental conditions. In this study, two-dimensional pure Cu mesh or Cu–10Ni (wt.%) alloy mesh reinforced SAC305 composite solders were employed to crea...

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Bibliographic Details
Main Authors: Jiajun Liu, Yong Xiao, Dan Li, Bowen Liu, Fei Yan, Shuye Zhang, Jian Zhang
Format: Article
Language:English
Published: Elsevier 2024-03-01
Series:Journal of Materials Research and Technology
Subjects:
Solid-liquid interdiffusion bonding
Cu–10Ni (wt.%) alloy mesh
SAC305 composite solder
EBSD characterization
Mechanical properties
Online Access:http://www.sciencedirect.com/science/article/pii/S2238785424003296

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http://www.sciencedirect.com/science/article/pii/S2238785424003296

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