Steady State Creep in Cu-Al Solid Solution Alloys at Intermediate Temperatures and Low Stresses

Steady State Creep in Cu-Al Solid Solution Alloys at Intermediate Temperatures and Low Stresses

Bibliographic Details
Main Authors: Kloc, L., Fiala, J., Cadek, J.
Format: Article
Language:English
Published: De Gruyter 1993-01-01
Series:High Temperature Materials and Processes
Online Access:https://doi.org/10.1515/HTMP.1993.12.1-2.77

Internet

https://doi.org/10.1515/HTMP.1993.12.1-2.77

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