Sub-Picosecond Micromachining of Monocrystalline Silicon for Solar Cell Manufacturing
In this study a prototype sub-picosecond laser was investigated for cutting and scribing of silicon wafers. The Yb:KYW laser used for this investigation, unlike ultrashort systems used previously, generates pulses of 650 fs, i.e., between the pico and femtosecond range. The laser was placed in a mic...
| Հիմնական հեղինակներ: | , |
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| Ձևաչափ: | Հոդված |
| Լեզու: | English |
| Հրապարակվել է: |
MDPI AG
2020-10-01
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| Շարք: | Applied Sciences |
| Խորագրեր: | |
| Առցանց հասանելիություն: | https://www.mdpi.com/2076-3417/10/20/7277 |