Interface evolution and mechanical properties of Sn–36Pb–2Ag solder joints under different aging conditions
Electronic packaging products are often subjected to reliability evaluation, Sn–Pb solder is widely used in high-reliability military products due to its excellent soldering performance. Sn–36Pb–2Ag eutectic solder joints were subjected to aging experiments at 75 °C, 100 °C, 125 °C, and 150 °C for 1...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785420321529 |