A PCB-Embedded 1.2 kV SiC MOSFET Package With Reduced Manufacturing Complexity

A PCB-Embedded 1.2 kV SiC MOSFET Package With Reduced Manufacturing Complexity

This article presents a printed circuit board (PCB) -embedded 1.2 kV silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) half-bridge package for a 22 kW electric vehicle (EV) on-board charger (OBC). The package meets the application's thermal and electrical re...

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Bibliographic Details
Main Authors: Jack Knoll, Christina DiMarino, Hannes Stahr, Mike Morianz
Format: Article
Language:English
Published: IEEE 2023-01-01
Series:IEEE Open Journal of Power Electronics
Subjects:
Electric vehicle
integration
on-board charger
packaging
PCB embedding
SiC MOSFET
Online Access:https://ieeexplore.ieee.org/document/10176350/

Internet

https://ieeexplore.ieee.org/document/10176350/

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