A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDs
As the demand for flexible organic light-emitting diodes (OLEDs) grows beyond that for rigid OLEDs, various elements of OLEDs, such as thin-film transistors, electrodes, thin-film encapsulations (TFEs), and touch screen panels, have been developed to overcome OLEDs’ physical and chemical limitations...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-09-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/13/9/1478 |