A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDs

As the demand for flexible organic light-emitting diodes (OLEDs) grows beyond that for rigid OLEDs, various elements of OLEDs, such as thin-film transistors, electrodes, thin-film encapsulations (TFEs), and touch screen panels, have been developed to overcome OLEDs’ physical and chemical limitations...

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Main Authors: Yongmin Jeon, Hyeongjun Lee, Hyeunwoo Kim, Jeong-Hyun Kwon
Format: Article
Language:English
Published: MDPI AG 2022-09-01
Series:Micromachines
Subjects:
Online Access:https://www.mdpi.com/2072-666X/13/9/1478
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author Yongmin Jeon
Hyeongjun Lee
Hyeunwoo Kim
Jeong-Hyun Kwon
author_facet Yongmin Jeon
Hyeongjun Lee
Hyeunwoo Kim
Jeong-Hyun Kwon
author_sort Yongmin Jeon
collection DOAJ
description As the demand for flexible organic light-emitting diodes (OLEDs) grows beyond that for rigid OLEDs, various elements of OLEDs, such as thin-film transistors, electrodes, thin-film encapsulations (TFEs), and touch screen panels, have been developed to overcome OLEDs’ physical and chemical limitations through material and structural design. In particular, TFEs, which protect OLEDs from the external environment, including reactive gases, heat, sunlight, dust, and particles, have technical difficulties to be solved. This review covers various encapsulation technologies that have been developed with the advent of atomic layer deposition (ALD) technology for highly reliable OLEDs, in which solutions to existing technical difficulties in flexible encapsulations are proposed. However, as the conventional encapsulation technologies did not show technological differentiation because researchers have focused only on improving their barrier performance by increasing their thickness and the number of pairs, OLEDs are inevitably vulnerable to environmental degradation induced by ultraviolet (UV) light, heat, and barrier film corrosion. Therefore, research on multi-functional encapsulation technology customized for display applications has been conducted. Many research groups have created functional TFEs by applying nanolaminates, optical Bragg mirrors, and interfacial engineering between layers. As transparent, wearable, and stretchable OLEDs will be actively commercialized beyond flexible OLEDs in the future, customized encapsulation considering the characteristics of the display will be a key technology that guarantees the reliability of the display and accelerates the realization of advanced displays.
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spelling doaj.art-ec7d0739dbd546ba83d944638b88c80b2023-11-23T17:50:12ZengMDPI AGMicromachines2072-666X2022-09-01139147810.3390/mi13091478A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDsYongmin Jeon0Hyeongjun Lee1Hyeunwoo Kim2Jeong-Hyun Kwon3Department of Biomedical Engineering, Gachon University, 1342 Seongnam-daero, Sujeong-gu, Seongnam-si 13120, KoreaDepartment of Display and Semiconductor Engineering, Sun Moon University, Asan 31460, KoreaDepartment of Display and Semiconductor Engineering, Sun Moon University, Asan 31460, KoreaDepartment of Display and Semiconductor Engineering, Sun Moon University, Asan 31460, KoreaAs the demand for flexible organic light-emitting diodes (OLEDs) grows beyond that for rigid OLEDs, various elements of OLEDs, such as thin-film transistors, electrodes, thin-film encapsulations (TFEs), and touch screen panels, have been developed to overcome OLEDs’ physical and chemical limitations through material and structural design. In particular, TFEs, which protect OLEDs from the external environment, including reactive gases, heat, sunlight, dust, and particles, have technical difficulties to be solved. This review covers various encapsulation technologies that have been developed with the advent of atomic layer deposition (ALD) technology for highly reliable OLEDs, in which solutions to existing technical difficulties in flexible encapsulations are proposed. However, as the conventional encapsulation technologies did not show technological differentiation because researchers have focused only on improving their barrier performance by increasing their thickness and the number of pairs, OLEDs are inevitably vulnerable to environmental degradation induced by ultraviolet (UV) light, heat, and barrier film corrosion. Therefore, research on multi-functional encapsulation technology customized for display applications has been conducted. Many research groups have created functional TFEs by applying nanolaminates, optical Bragg mirrors, and interfacial engineering between layers. As transparent, wearable, and stretchable OLEDs will be actively commercialized beyond flexible OLEDs in the future, customized encapsulation considering the characteristics of the display will be a key technology that guarantees the reliability of the display and accelerates the realization of advanced displays.https://www.mdpi.com/2072-666X/13/9/1478thin-film encapsulationorganic light-emitting diodeenvironmental reliabilityatomic layer depositiontransparent flexible display
spellingShingle Yongmin Jeon
Hyeongjun Lee
Hyeunwoo Kim
Jeong-Hyun Kwon
A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDs
Micromachines
thin-film encapsulation
organic light-emitting diode
environmental reliability
atomic layer deposition
transparent flexible display
title A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDs
title_full A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDs
title_fullStr A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDs
title_full_unstemmed A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDs
title_short A Review of Various Attempts on Multi-Functional Encapsulation Technologies for the Reliability of OLEDs
title_sort review of various attempts on multi functional encapsulation technologies for the reliability of oleds
topic thin-film encapsulation
organic light-emitting diode
environmental reliability
atomic layer deposition
transparent flexible display
url https://www.mdpi.com/2072-666X/13/9/1478
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