Microstructure and mechanical property of full Cu3Sn solder joints during high-temperature aging
620 ℃ thermal aging was carried out on full Cu3Sn solder joints for various duration, the microstructure evolution of solder joints were investigated. The mechanical properties of solder joints after aging were characterized by nano indentation test and shear test. The results show that, during the...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | zho |
| Published: |
Journal of Materials Engineering
2022-09-01
|
| Series: | Cailiao gongcheng |
| Subjects: | |
| Online Access: | http://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2021.000977 |