Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet

Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet

This study is to investigate the dependence of cover lay’s adhesive thickness on the laminating press’s opening-stacking position. Cover lays using acrylic-and epoxy-based adhesives were laminated onto similar size copper clad laminate (CCL) at 140 bars and 195°C for 150 min. Adh...

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Bibliographic Details
Main Authors: Kok Tee Lau, Hoi Ern Kok, Hairul Effendy Bin Ab Maulod, Nurizzatul Zahirah Binti Abdul Latiff, Aida Nazifa Binti Abdul Aziz, Nur Hazirah Binti Rosli
Format: Article
Language:English
Published: MMU Press 2019-06-01
Series:Journal of Engineering Technology and Applied Physics
Subjects:
flexible electronics
adhesive layer
flexible printed circuit
adhesive
copper clad laminate
Online Access:https://journals.mmupress.com/index.php/jetap/article/view/11/302

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https://journals.mmupress.com/index.php/jetap/article/view/11/302

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