Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet
This study is to investigate the dependence of cover lay’s adhesive thickness on the laminating press’s opening-stacking position. Cover lays using acrylic-and epoxy-based adhesives were laminated onto similar size copper clad laminate (CCL) at 140 bars and 195°C for 150 min. Adh...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
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MMU Press
2019-06-01
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| Series: | Journal of Engineering Technology and Applied Physics |
| Subjects: | |
| Online Access: | https://journals.mmupress.com/index.php/jetap/article/view/11/302 |
| _version_ | 1797862548960182272 |
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| author | Kok Tee Lau Hoi Ern Kok Hairul Effendy Bin Ab Maulod Nurizzatul Zahirah Binti Abdul Latiff Aida Nazifa Binti Abdul Aziz Nur Hazirah Binti Rosli |
| author_facet | Kok Tee Lau Hoi Ern Kok Hairul Effendy Bin Ab Maulod Nurizzatul Zahirah Binti Abdul Latiff Aida Nazifa Binti Abdul Aziz Nur Hazirah Binti Rosli |
| author_sort | Kok Tee Lau |
| collection | DOAJ |
| description | This study is to investigate the dependence of cover lay’s adhesive thickness on the laminating press’s opening-stacking position. Cover lays using acrylic-and epoxy-based adhesives were laminated onto similar size copper clad laminate (CCL) at 140 bars and 195°C for 150 min. Adhesive thickness measurements show opening-stacking positions near to the bottom of laminating press machine produced more consistent adhesive thickness as compared to the top positions. |
| first_indexed | 2024-04-09T22:22:14Z |
| format | Article |
| id | doaj.art-ee038ca697bb4c0395e9f61203a28542 |
| institution | Directory Open Access Journal |
| issn | 2682-8383 |
| language | English |
| last_indexed | 2024-04-09T22:22:14Z |
| publishDate | 2019-06-01 |
| publisher | MMU Press |
| record_format | Article |
| series | Journal of Engineering Technology and Applied Physics |
| spelling | doaj.art-ee038ca697bb4c0395e9f61203a285422023-03-22T15:10:00ZengMMU PressJournal of Engineering Technology and Applied Physics2682-83832019-06-01111310.33093/jetap.2019.1.1.1Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit SheetKok Tee Lau0Hoi Ern Kok1Hairul Effendy Bin Ab Maulod2Nurizzatul Zahirah Binti Abdul Latiff3Aida Nazifa Binti Abdul Aziz4Nur Hazirah Binti Rosli5Carbon Research Technology Research Group, Advanced Manufacturing Centre, Universiti Teknikal Malaysia MelakaFakulti Teknologi Kejuruteraan Mekanikal dan Pembuatan, Universiti Teknikal Malaysia MelakaCarbon Research Technology Research Group, Advanced Manufacturing Centre, Universiti Teknikal Malaysia MelakaFakulti Teknologi Kejuruteraan Mekanikal dan Pembuatan, Universiti Teknikal Malaysia MelakaFakulti Teknologi Kejuruteraan Mekanikal dan Pembuatan, Universiti Teknikal Malaysia MelakaMFS Technology (M) Sdn. BhdThis study is to investigate the dependence of cover lay’s adhesive thickness on the laminating press’s opening-stacking position. Cover lays using acrylic-and epoxy-based adhesives were laminated onto similar size copper clad laminate (CCL) at 140 bars and 195°C for 150 min. Adhesive thickness measurements show opening-stacking positions near to the bottom of laminating press machine produced more consistent adhesive thickness as compared to the top positions.https://journals.mmupress.com/index.php/jetap/article/view/11/302flexible electronicsadhesive layerflexible printed circuitadhesivecopper clad laminate |
| spellingShingle | Kok Tee Lau Hoi Ern Kok Hairul Effendy Bin Ab Maulod Nurizzatul Zahirah Binti Abdul Latiff Aida Nazifa Binti Abdul Aziz Nur Hazirah Binti Rosli Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet Journal of Engineering Technology and Applied Physics flexible electronics adhesive layer flexible printed circuit adhesive copper clad laminate |
| title | Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet |
| title_full | Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet |
| title_fullStr | Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet |
| title_full_unstemmed | Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet |
| title_short | Effect of Laminating Press’s Opening-Stacking Position on Adhesive Thickness in Coverlay/Adhesive/Flexible-Printed-Circuit Sheet |
| title_sort | effect of laminating press s opening stacking position on adhesive thickness in coverlay adhesive flexible printed circuit sheet |
| topic | flexible electronics adhesive layer flexible printed circuit adhesive copper clad laminate |
| url | https://journals.mmupress.com/index.php/jetap/article/view/11/302 |
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