A Generation and Repair Approach to Scheduling Semiconductor Packaging Facilities Using Case-Based Reasoning
As the demand for multi-chip products with high capacity and small size increases, semiconductor packaging facilities have been faced with complicated constraints such as re-entrant flows, sequence dependent setups, and alternative routes, which leads to difficulties in scheduling semiconductor manu...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2023-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10129182/ |