Analysis of Cu-Graphene Interconnects

Analysis of Cu-Graphene Interconnects

Due to its ultrathin feature, graphene has been recently proposed as diffusion barrier layer for Cu wires. This paper is geared toward developing an equivalent single-conductor (ESC) transmission-line (TL) model for analysis of Cu-graphene interconnects, i.e., Cu wires encapsulated with graphene bar...

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Bibliographic Details
Main Authors: Zi-Han Cheng, Wen-Sheng Zhao, Da-Wei Wang, Jing Wang, Linxi Dong, Gaofeng Wang, Wen-Yan Yin
Format: Article
Language:English
Published: IEEE 2018-01-01
Series:IEEE Access
Subjects:
Cu-graphene interconnect
diffusion barrier layer
equivalent single-conductor (ESC) model
transfer function
time delay
Online Access:https://ieeexplore.ieee.org/document/8458119/

Internet

https://ieeexplore.ieee.org/document/8458119/

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