Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint by ultrasonic-assisted soldering method
Improving the reliability of the solder joint has been the recent research focus in the electronic packaging field due to the increasing degree of integration in the electronic devices. During the reflow soldering process, when the local component is heterogeneous, the coarse structure of the solder...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-09-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785421006554 |