Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint by ultrasonic-assisted soldering method
Improving the reliability of the solder joint has been the recent research focus in the electronic packaging field due to the increasing degree of integration in the electronic devices. During the reflow soldering process, when the local component is heterogeneous, the coarse structure of the solder...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2021-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785421006554 |
| _version_ | 1830510369827717120 |
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| author | Baishan Chen Yufeng Huang Siwei Tang Wensheng Liu Yunzhu Ma |
| author_facet | Baishan Chen Yufeng Huang Siwei Tang Wensheng Liu Yunzhu Ma |
| author_sort | Baishan Chen |
| collection | DOAJ |
| description | Improving the reliability of the solder joint has been the recent research focus in the electronic packaging field due to the increasing degree of integration in the electronic devices. During the reflow soldering process, when the local component is heterogeneous, the coarse structure of the solder joint is easy to grow, which deteriorates the performance of the solder joint. In this study, Au-20Sn/Au/Ni(P)/Kovar joints were prepared using ultrasonic-assisted reflow soldering process. Ultrasonication during reflow improved the wettability and shear strength between the Au-20Sn solder and Kovar substrate. The applied ultrasound can break the primary Au5Sn grain and refine the eutectic microstructure through acoustic cavitation. Meanwhile, ultrasound induced the formation of a new intermetallic compound (IMC) layer that was identified as Ni3P (ca 120 nm), which inhibited the diffusion of Ni from substrate into the solder matrix. The mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint treated with 80 W ultrasonic vibration (USV) increased by 46.94% as compared to the control sample. The current study provides a new strategy for high-performance packaging in electronic devices in extreme environments. |
| first_indexed | 2024-12-22T01:51:38Z |
| format | Article |
| id | doaj.art-ef5404d5a8c04a9daa7a91b92d245330 |
| institution | Directory Open Access Journal |
| issn | 2238-7854 |
| language | English |
| last_indexed | 2024-12-22T01:51:38Z |
| publishDate | 2021-09-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj.art-ef5404d5a8c04a9daa7a91b92d2453302022-12-21T18:42:55ZengElsevierJournal of Materials Research and Technology2238-78542021-09-0114703718Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint by ultrasonic-assisted soldering methodBaishan Chen0Yufeng Huang1Siwei Tang2Wensheng Liu3Yunzhu Ma4National Key Laboratory of Science and Technology for National Defence on High-strength Structural Materials, Central South University, Changsha 410083, PR ChinaCorresponding author.; National Key Laboratory of Science and Technology for National Defence on High-strength Structural Materials, Central South University, Changsha 410083, PR ChinaNational Key Laboratory of Science and Technology for National Defence on High-strength Structural Materials, Central South University, Changsha 410083, PR ChinaNational Key Laboratory of Science and Technology for National Defence on High-strength Structural Materials, Central South University, Changsha 410083, PR ChinaNational Key Laboratory of Science and Technology for National Defence on High-strength Structural Materials, Central South University, Changsha 410083, PR ChinaImproving the reliability of the solder joint has been the recent research focus in the electronic packaging field due to the increasing degree of integration in the electronic devices. During the reflow soldering process, when the local component is heterogeneous, the coarse structure of the solder joint is easy to grow, which deteriorates the performance of the solder joint. In this study, Au-20Sn/Au/Ni(P)/Kovar joints were prepared using ultrasonic-assisted reflow soldering process. Ultrasonication during reflow improved the wettability and shear strength between the Au-20Sn solder and Kovar substrate. The applied ultrasound can break the primary Au5Sn grain and refine the eutectic microstructure through acoustic cavitation. Meanwhile, ultrasound induced the formation of a new intermetallic compound (IMC) layer that was identified as Ni3P (ca 120 nm), which inhibited the diffusion of Ni from substrate into the solder matrix. The mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint treated with 80 W ultrasonic vibration (USV) increased by 46.94% as compared to the control sample. The current study provides a new strategy for high-performance packaging in electronic devices in extreme environments.http://www.sciencedirect.com/science/article/pii/S2238785421006554Au-20Sn solderUltrasonic solderingIntermetallic compoundShear strengthMicrostructure |
| spellingShingle | Baishan Chen Yufeng Huang Siwei Tang Wensheng Liu Yunzhu Ma Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint by ultrasonic-assisted soldering method Journal of Materials Research and Technology Au-20Sn solder Ultrasonic soldering Intermetallic compound Shear strength Microstructure |
| title | Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint by ultrasonic-assisted soldering method |
| title_full | Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint by ultrasonic-assisted soldering method |
| title_fullStr | Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint by ultrasonic-assisted soldering method |
| title_full_unstemmed | Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint by ultrasonic-assisted soldering method |
| title_short | Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint by ultrasonic-assisted soldering method |
| title_sort | tuning the microstructure and enhancing the mechanical properties of au 20sn au ni p kovar joint by ultrasonic assisted soldering method |
| topic | Au-20Sn solder Ultrasonic soldering Intermetallic compound Shear strength Microstructure |
| url | http://www.sciencedirect.com/science/article/pii/S2238785421006554 |
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