Semi-additive patterning process based fabrication of miniaturized, package-embedded high conversion ratio inductors for DC-DC converters

Semi-additive patterning process based fabrication of miniaturized, package-embedded high conversion ratio inductors for DC-DC converters

Many data centers currently operate at low power efficiencies (∼75%) because of the many voltage conversions necessary to step down inputs from 48 V to 1 V. This voltage step-down is accomplished in the Power System-on-Chip (PwrSoC) package, which contain large quantities of surface mount inductors....

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Bibliographic Details
Main Authors: Prahalad Murali, Claudio Alvarez, Srinidhi Suresh, Mark D. Losego, Madhavan Swaminathan, Yusuke Oishi, Tomohito Uemura, Ryo Nagatsuka, Naoki Watanabe
Format: Article
Language:English
Published: Elsevier 2022-10-01
Series:Power Electronic Devices and Components
Subjects:
Embedded inductors
SAP
Fabrication
Metal polymer composite
Online Access:http://www.sciencedirect.com/science/article/pii/S2772370422000207

Internet

http://www.sciencedirect.com/science/article/pii/S2772370422000207

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