Computational fluid dynamics modeling of a wafer etch temperature control system

Next-generation etching processes for semiconductor manufacturing exploit the potential of a variety of operating conditions, including cryogenic conditions at which high etch rates of silicon and very low etch rates of the photoresist are achieved. Thus, tight control of wafer temperature must be m...

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Bibliographic Details
Main Authors: Henrique Oyama, Kip Nieman, Anh Tran, Bernard Keville, Yewei Wu, Helen Durand
Format: Article
Language:English
Published: Elsevier 2023-09-01
Series:Digital Chemical Engineering
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S2772508123000200