Effect of Aging Time on Deformation Behavior of Lead-Free and Lead Base Solders Alloys
The effect of aging time on the deformation behavior of lead-free and lead- based sub-mm solder alloys were investigated. Experimental results showed that the aging time (less than 4 hours) did not have any effect on the anisotropy behavior of Tin solder balls during compression processes but that i...
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| Format: | Article |
| Language: | English |
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Unviversity of Technology- Iraq
2018-08-01
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| Series: | Engineering and Technology Journal |
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| Online Access: | https://etj.uotechnology.edu.iq/article_175257_cf31e15e21ecbba0c53c3bfe3e1494c5.pdf |